Hai Liu

Hai Liu

Assistant Professor,
School of Electrical, Computer and Energy Engineering
  • [email protected]
  • 551 E Tyler Mall, Room 157, Engineering Research Center (ERC) Tempe, AZ 85281
  • Mail code: 5706
    Campus: Tempe
  • ‌
Biography Research Teaching Public Work Industry Experience
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Long Bio

Openings: Prof. Liu is actively recruiting motivated Ph.D. and M.S. students in heterogeneous integration, advanced semiconductor packaging, and MEMS/microsystems. If interested, please send your CV and transcripts to [email protected].

Hai Liu, Ph.D., is an Assistant Professor in the School of Electrical, Computer and Energy Engineering (ECEE) at Arizona State University. His research focuses on advanced semiconductor electronics and photonics packaging, as well as micro-electro-mechanical systems (MEMS), bridging cutting-edge device innovation and system integration with applications in computing, communications, sensing, and healthcare.

Prior to joining ASU in August 2026, Prof. Liu had more than a decade of industry leadership in semiconductor packaging R&D. Most recently, he was a Hardware Engineering Technical Leader at Cisco Systems, Inc., advancing 3D heterogeneous integration and photonics packaging for co-packaged optics (CPO) to support AI data centers. He previously held senior engineering roles at TDK InvenSense and Samsung Semiconductor, where he developed electronics packaging solutions spanning ultrasonic sensors, motion sensors, and memory and processing chips. This extensive semiconductor industry experience gives his research a strong foundation in the practical challenges of devices, packaging, and system integration.

Prof. Liu earned his Ph.D. in Electrical Engineering from the University of Southern California in 2022, advised by Prof. Eun Sok Kim. His doctoral research on piezoelectric MEMS produced cochlea-inspired Resonant Microphone Arrays (RMAs) for lung sound detection, achieving a signal-to-noise ratio of 79–98 dBA. By combining these RMAs with machine learning, he demonstrated markedly improved detection of respiratory wheezing compared to conventional microphones, with direct implications for next-generation wearable health monitoring.

Prof. Liu is a Senior Member of IEEE and holds 6 granted patents. His research has been published in leading journals and conferences including IEDM, ECTC, MEMS, and JMM, and was recognized with the Samsung Electronics R&D Gold Prize in 2009 and was a finalist for the Outstanding Student Paper Award at IEEE MEMS 2020. He also contributes to the research community as a reviewer for the IEEE Sensors Conference and journals published by IEEE, ASME, and Nature Portfolio.

 

Education

Ph.D. Electrical Engineering, University of Southern California, Los Angeles, CA, 2022
M.S. Materials Science, Harbin Institute of Technology, Harbin, China, 2006
B.S. Metal Materials Engineering, Harbin Institute of Technology, Harbin, China, 2004                                                                      

CV
Curriculum Vitae
Google Scholar URL
https://scholar.google.com/citations?user=6PXqZwYAAAAJ&hl=en&oi=ao
ORCID Profile ID
https://orcid.org/0000-0003-4461-9748
Research Interests
  • Heterogeneous Integration & Semiconductor Packaging
  • Microsystems & MEMS
Publications

Semiconductor Packaging 

  1. Liu, Hai, Li Jin, Liqun Gu, Juanjuan Li, Ying Li, Qiang Chen, Maouha Du, Jianwei Zhou, and TaeSub Chang. "Solder joint reliability with various silver finish on PCB." In 2014 15th International Conference on Electronic Packaging Technology, pp. 396-400. IEEE, 2014.
  2. Liu, Hai, Zhenqing Zhao, Qiang Chen, Jianwei Zhou, Maohua Du, Senyun Kim, Jonghyun Chae, and Myungkee Chung. "Reliability of copper wire bonding in humidity environment." In 2011 IEEE 13th Electronics Packaging Technology Conference, pp. 53-58. IEEE, 2011.
  3. Chen, Qiang, Zhenqing Zhao, Hai Liu, Jonghyun Chae, Senyun Kim, and Myungkee Chung. "Investigation of various pad structure influence for copper wire bondability." In 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, pp. 1-4. IEEE, 2011.
  4. Liu, Hai, Qi Chen, Zhenqing Zhao, Qian Wang, Jianfeng Zeng, and Jonghyun Chae. "Reliability of Au-Ag alloy wire bonding." In 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), pp. 234-239. IEEE, 2010.
  5. Zhang, Jing, Hai Liu, and Jaisung Lee. "Board level cyclic bending test for MCP package." In 2007 9th Electronics Packaging Technology Conference, pp. 459-462. IEEE, 2007.
  6. Liu, Hai, Jing Zhang, Song Chen, Maohua Du, Nufeng Feng, Qian Wang, and Taekoo Lee. "Board level thermal cycle reliability of BGA for a new type of pad structure with OSP surface finish." In 2007 8th International Conference on Electronic Packaging Technology, pp. 1-3. IEEE, 2007. 

MEMS Resonant Microphone Array (RMA) 

  1. Sengupta, Anik, Akash Roy, Hongxiang Gao, Matin Barekatain, Hai Liu, and Eun Sok Kim. "Wearable Stethoscope Based on Resonant Microphone Array with Wireless Data Transfer." In 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS), pp. 101-104.
  2. Liu, Hai, M. Barekatain, A. Roy, S. Liu, Y. Cao, Y. Tang, A. Shkel and E.S. Kim, “MEMS Piezoelectric Resonant Microphone Array for Lung Sound Classification,” Journal of Micromechanics and Microengineering, 33, No. 4 (2023), 044003.
  3. Dodson, A., A. Jostes, D. Cerrone, H. Liu, E. S. Kim, and R. M. Kato. "Electronic Stethoscope Lung Sounds Analysis Versus Spirometry to Detect Change With Bronchodilator Use in Pediatric Asthma Patients." In American Thoracic Society International Conference Meetings Abstracts, vol. 207, no. Supplement_1, pp. A2951-A2951. Oxford University Press, 2023.
  4. Liu, Hai, Song Liu, Anton A. Shkel, Yongkui Tang, and Eun Sok Kim. "Multi-band MEMS resonant microphone array for continuous lung-Sound monitoring and classification." In 2020 IEEE 33rd International Conference on Micro Electro MechanicalSystems (MEMS), pp. 857-860. IEEE, 2020. Outstanding Student Paper Award Finalist (18/275)
  5. Liu, Hai, Song Liu, Anton A. Shkel, and Eun Sok Kim. "Active noise cancellation with MEMS resonant microphone array." Journal of Microelectromechanical Systems 29, no. 5 (2020): 839-845.
  6. Liu, Hai, Song Liu, Anton A. Shkel, Yongkui Tang, and Eun Sok Kim. "MEMS resonant microphone array for lung sound classification." In 2019 IEEE International Electron Devices Meeting (IEDM), pp. 34-4. IEEE, 2019. 

MEMS Energy Generators 

  1. Barekatain, Matin, Hai Liu, and Eun Sok Kim. "Wireless and Battery-Less Tamper Detection With Pyroelectric Energy Converter and High-Overtone Bulk Acoustic Resonator." IEEE Sensors Journal 22, no. 14 (2022): 14639-14646.
  2. Fan, Shuyu, Yongkui Tang, Lurui Zhao, Hai Liu, Yufeng Wang, Dibo Hou, and Yunqi Cao. "Design optimization of microfabricated coils for volume-limited miniaturized broadband electromagnetic vibration energy harvester." Energy Conversion and Management 271 (2022): 116299. 

MEMS Ultrasonic Transducer 

  1. Liu, Song, Pengcheng Sun, Mingyue Wang, Yujie Jiang, Jiaqi Li, Yuyu Jia, Zhenhuan Sun, Hai Liu, Haojian Lu, and Zuankai Wang. "Acousto-dewetting enables droplet microfluidics on superhydrophilic surfaces." Nature Physics (2025): 1-9.
  2. Li, Jiaqi, Z. Sun, H. Liu and S. Liu, "MEMS Amplitude-Gradient Acoustic Transducer (AGAT) for Controllable Particle Transportation," 2025 IEEE International Ultrasonics Symposium (IUS), Utrecht, Netherlands, 2025, pp. 1-4, doi: 10.1109/IUS62464.2025.11201785.
  3. Li, Jiaqi, Zhenhuan Sun, Hai Liu, and Song Liu. "Obstacle-crossing Self Focused Acoustic Transducer based on Bessel Beams." In 2024 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium (UFFC-JS), pp. 1-4. IEEE, 2024.
  4. Li, Jiaqi, Zhenhuan Sun, Yuyu Jia, Tang Li, Haojian Lu, Lurui Zhao, Hai Liu, and Song Liu. "MEMS First-Order Bessel Beam Acoustic Transducer for Particle Trapping And Controllable Rotating." In 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS), pp. 965-968. IEEE, 2023.
  5. Jiaqi Li, Zhenhuan Sun, Hai Liu, Lurui Zhao, Teng Li, and Song Liu, "Bottle trap acoustic transducer with PDMS Lens for Particle Trapping", In 2023 IEEE International Ultrasonics Symposium (IUS), IEEE, 2023.
  6. Sun, Zhenhuan, Jiaqi Li, Hai Liu, Lurui Zhao, Teng Li, and Song Liu. "Rotation-free high order Bessel beam acoustic transducer for particle trapping." In 2023 IEEE International Ultrasonics Symposium (IUS), IEEE, 2023.
  7. Li, Jiaqi, Zhenhuan Sun, Hai Liu, Lurui Zhao, Teng Li, and Song Liu. "Twin Trap Acoustic Transducer with PDMS Fresnel Lens for Particle Trapping." In 2023 IEEE International Ultrasonics Symposium (IUS), IEEE, 2023.
  8. Sun, Zhenhuan, Jiaqi Li, Hai Liu, Lurui Zhao, Teng Li, and Song Liu. "Ultrasonic Transducer encoding intersecting Bessel beams for particle patterning." In 2023 IEEE International Ultrasonics Symposium (IUS), IEEE, 2023.
  9. Jia, Yuyu, Zhenhuan Sun, Jiaqi Li, Lurui Zhao, Hai Liu, Teng Li, and Song Liu. "MEMS Bessel Beam Acoustic Transducer (MEMS-BBAT) with Air-Cavity Lens Based on Spiral Diffraction Grating for Particle Trapping." In 2022 IEEE International Ultrasonics Symposium (IUS), 2022.
  10. Sun, Zhenhuan, Jiaqi Li, Yuyu Jia, Yuhang Liu, Kunyong Lyu, Hai Liu, Hu Su, Teng Li, and Song Liu. "Particle Trapping and Transportation with MEMS Zeroth-order Bessel Beam Acoustic Transducer (BBAT)." In 2022 IEEE International Conference on Robotics and Biomimetics (ROBIO), pp. 1-6. IEEE, 2022.
  11. Liu, Hai, A. Roy, Y. Tang, M. Barekatain and E.S. Kim, “Ultrasonic Air-Borne Propulsion Through Synthetic Jets,” Solid-State Sensor and Actuator Workshop, Hilton Head Island, SC, June 5 - 9, 2022, pp. 226 - 229. 

Granted Patents  

  1. Liu, Hai. "Methods of manufacturing printed circuit board and semiconductor package." U.S. Patent 10,049,970 B2, issued August 14, 2018.
  2. Liu, Hai. "Printed circuit board for semiconductor package." U.S. Patent 9,504,152 B2, issued November 22, 2016.
  3. Liu, Hai. Surface Coating and Semiconductor Packaging Including the Surface Coating, Chinese patent 106954335 B, issued September 17, 2019.
  4. Liu, Hai. Printed Circuit Board and Semiconductor Packaging Including It, Chinese patent 105307386 B, issued July 06, 2018.
  5. Liu, Hai. A Mixed Surface Coating and Its Manufacturing Method, Chinese patent 103227160 B, issued March 16, 2016
  6. Lu, Kai, Hai Liu. Mixed Solder Ball Arrangement and Its Formation Method, Chinese patent 103219310 B, issued July 13, 2016. 

 

 

Presentations

Course instruction will begin in Spring 2027

Honors / Awards
  • IEEE Senior Member 2023
Service

  • Academic Journal reviewer  

    - Springer Nature: Scientific Reports (2023, 2024), Microsystems and   Nanoengineering (2023), Microsystem Technologies (2023, 2024) 

    - ASME: Journal of Electronics Packaging (2023, 2024, 2025) 

    - IEEE: Electronic Device Letter (2023, 2025), IEEE Transactions on Components, Packaging and Manufacturing Technology (2023, 2024), Sensors Journal (2025) 

    - MDPI: Micromachines (2023), Sensors (2023, 2024, 2025), Remote Sensing (2023, 2024), Energies (2023), ENG (2023), Applied Science (2023) 

    - IOP Publishing: Engineering Research Express (2024), Smart Materials and Structures (2024), Journal of Micromechanics and Microengineering (2025) 

    - Other: AME Journal of Thoracic Disease (2023) 

  • Academic Conference Review Committee - IEEE Sensors 2023, 2024.
  • IEEE Senior Members Application Review Panel (2025) 
Industry Positions
  • Hardware Engineering Technical Leader, Cisco Systems, Inc., Holmdel, NJ, USA, 
    Feb 2025 – July 2026                                                               
  • Staff Package Assembly Engineer, InvenSense, Inc., San Jose, CA, USA, 
    July 2022 – Feb 2025                                                                            
  • Semiconductor Packaging R&D Engineer, Samsung Semiconductor China R&D Co. Ltd., Suzhou, Jiangsu, China, July 2006 - July 2016 
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