Christopher Bailey

Recent Publications:

1. P. Rajaguru, T. Tilford, C. Bailey and S. Stoyanov, "Damage Mechanics-Based Failure Prediction of Wirebond in Power Electronic Module," in IEEE Access, vol. 12, pp. 25215-25227, (2024), doi: 10.1109/ACCESS.2023.3342689.
2. S. Stoyanov and C. Bailey, "Modeling Insights Into the Assembly Challenges of Focal Plane Arrays," in IEEE Access, vol. 11, pp. 35207-35219, 2023, doi: 10.1109/ACCESS.2023.3264806.
3. Nwanoro K, Lu H, Yin C, Bailey C, Advantages of the extended finite element method for the analysis of crack propagation in power modules (2023), Power Electronic Devices and Components, V4, DOI: 10.1016/j.pedc.2022.100027
4. Xu Y, Xian J, Stoyanov S, Bailey C, Coyle R, Gourlay C, Dunne F, A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints, International Journal of Plasticity, V155, (2022), DOI: 10.1016/j.ijplas.2022.103308
5. Stoyanov S, Bailey C, Deep Learning Modelling for Composite Properties of PCB Conductive Layers, (2022) 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), St Julian, Malta, 2022, pp. 1-7, DOI: 10.1109/EuroSimE54907.2022.9758885.
6. Santhanakrishnan, M.S., Tilford, T. and Bailey, C, Multi-objective NSGA-II based shape optimisation of the cross-sectional shape of passively cooled heat sinks (2022), International Journal of Numerical Methods for Heat & Fluid Flow, Vol. 32 No. 3, pp. 1025-1045. DOI: 10.1108/HFF-10-2020-0656
7. Tilford, T., Stoyanov, S., Bruan, J., Jahnsen JC., Patel, MK., Bailey, C. Comparative reliability of ink-jet printed electronics packaging (2021), IEEE Transactions on Components, Packaging, and Manufacturing Technology, 11 (2), pp 351-362 . DOI: 10.1109/TCPMT.2021.3049952.
8. Rajaguru P, Bella M, Bailey C, Applying Model Order Reduction to the Reliability Prediction of Power Electronic Module Wirebond Structure (2021) 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Berlin, Germany, 2021, pp. 1-6, DOI: 10.1109/THERMINIC52472.2021.9626396.
9. Stoyanov S, Stewart P, Bailey C, Reliability Optimisation and Lifetime Modelling of micro-BGA Assemblies in Harsh Environment Applications (2021) 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC), Gothenburg, Sweden, 2021, pp. 1-8, DOI: 10.23919/EMPC53418.2021.9584970.
10. Daniel N, Stoyanov S, Bailey C, Flynn D, Review of Fusion Prognostics for Lithium-Ion Batteries - Current State and Future Challenges (2021) 44th International Spring Seminar on Electronics Technology (ISSE), Bautzen, Germany, 2021, pp. 1-8, DOI: 10.1109/ISSE51996.2021.9467644.
11. Daniel N, Stoyanov S, Bailey C, Flynn D, Improved Battery Degradation Modelling with Coupled Physical and Machine Learning Modelling  (2021) 44th International Spring Seminar on Electronics Technology (ISSE), Bautzen, Germany, 2021, pp. 1-6, DOI: 10.1109/ISSE51996.2021.9467565.
12. Bailey C, Modeling for assessing Semiconductor Packages in High-Reliability Applications, (2021), 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), Chengdu, China, 2021, pp. 1-3, DOI: 10.1109/EDTM50988.2021.9434881
13. Shahjalal M., Ahmed M.R., Lu H., Bailey C., Forsyth A.J. An Analysis of the Thermal Interaction between Components in Power Converter Applications (2020) IEEE Transactions on Power Electronics, 30 (9), pp. 9082 – 9094. DOI: 10.1109/TPEL.2020.2969350
14. Ahsan M., Stoyanov S., Bailey C., Albarbar A. Developing Computational Intelligence for Smart Qualification Testing of Electronic Products (2020) IEEE Access, 8, pp. 16922 – 16933. DOI: 10.1109/ACCESS.2020.2967858
15. Stoyanov S., Bailey C., Stewart P., Parker M., Roulston J.F. Experimental and modeling study on delamination risks for refinished electronic packages under hot solder dip loads (2020) IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (3), pp. 502 – 515. DOI: 10.1109/TCPMT.2020.2972635
16. Yin C., Stoyanov S., Bailey C., Stewart P. Thermomechanical Analysis of Conformally Coated QFNs for High-Reliability Applications (2020) IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (11), pp. 2210 – 2218. DOI: 10.1109/TCPMT.2019.2925874
17. Tonry C.E.H., Patel M.K., Yu W., Desmulliez M.P.Y., Bailey C. Fabrication of hollow polymer microstructures using dielectric and capillary forces (2020) Microsystem Technologies, 26 (2), pp. 301 – 308. DOI: 10.1007/s00542-019-04409-z
18. Rajaguru P., Lu H., Bailey C., Bella M. Modelling and analysis of vibration on power electronic module structure and application of model order reduction (2020) Microelectronics Reliability, 110, DOI: 10.1016/j.microrel.2020.113697
19. Hinojosa Herrera A.E., Walshaw C., Bailey C. Improving Black Box Classification Model Veracity for Electronics Anomaly Detection (2020) Proceedings of the 15th IEEE Conference on Industrial Electronics and Applications, ICIEA 2020, pp. 1092 – 1097, DOI: 10.1109/ICIEA48937.2020.9248258
20. Stoyanov S., Bailey C., Stewart P., Morrison G. Reliability impact of assembly materials for Micro-BGA components in high reliability applications (2020) Proceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020, DOI: 10.1109/ESTC48849.2020.9229828
21. Stoyanov S, Bailey C, Waite R, Hicks C, Golding T, Modelling Indium Interconnects for Ultra Fine-Pitch Focal Plane Arrays,(2020) 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Orlando, FL, USA, 2020, pp. 1139-1146, DOI: 10.1109/ITherm45881.2020.9190397.
22. Herrera, A, Walshaw C, Bailey C, Failure Mode & Effect Analysis and another Methodology for Improving Data Veracity and Validity  Annals of Emerging Technologies in Computing (AETiC), pp. 9-16, Vol. 4, No. 3, (2020, DOI: 10.33166/AETiC.2020.03.002.
23. Bailey C, Advances in Power Electronics (2020) Pan Pacific Microelectronics Symposium (Pan Pacific), HI, USA, 2020, pp. 1-4, DOI:10.23919/PanPacific48324.2020.9059348.
24. Stoyanov, S., Ahsan, M., Bailey, C., Wotherspoon, T., Hunt, C. Predictive analytics methodology for smart qualification testing of electronic components (2019) Journal of Intelligent Manufacturing, 30 (3), pp. 1497-1514. DOI: 10.1007/s10845-018-01462-9
25. Rajaguru, P., Lu, H., Bailey, C. Time integration damage model for Sn3.5Ag solder interconnect in power electronic module (2019) IEEE Transactions on Device and Materials Reliability, 19 (1), art. no. 8606225, pp. 140-148. DOI: 10.1109/TDMR.2019.2891949
26. Tonry, C.E.H., Patel, M.K., Yu, W., Desmulliez, M.P.Y., Bailey, C. Fabrication of hollow polymer microstructures using dielectric and capillary forces (2019) Microsystem Technologies, DOI: 10.1007/s00542-019-04409-z
27. Dinmohammadi, F., Flynn, D., Bailey, C., Pecht, M., Yin, C., Rajaguru, P., Robu, V. Predicting damage and life expectancy of subsea power cables in offshore renewable energy applications (2019) IEEE Access, 7, art. no. 8704223, pp. 54658 -54669. DOI: 10.1109/ACCESS.2019.2911260
28. Adamietz, R., Desmulliez, M.P.Y., Pavuluri, S.K., Tilford, T., Bailey, C., Schreier-Alt, T., Warmuth, J. Reliability Testing and Stress Measurement of QFN Packages Encapsulated by an Open-Ended Microwave Curing System (2019) IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1), art. no. 8418396, pp. 173-180. DOI: 10.1109/TCPMT.2018.2859031
29. Malik, A., Bailey, C., Stoyanov, S. Identifying the Optimal Step Size for Gradient Descent Using Monte Carlo Simulation in Optimisation of Micro-laser Welding of Optoelectronics (2019) ITT 2018 - Information Technology Trends: Emerging Technologies for Artificial Intelligence, art. no. 8649548, pp. 281-285. DOI: 10.1109/CTIT.2018.8649548
30. Rajaguru P, Santhanakrishnan M, Tilford T, Bailey C, Design of Additively Manufactured Heatsinks for Power Electronics Thermal Management using Adjoint Level-set Topology Optimization (2019) 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Lecco, Italy, 2019, pp. 1-7, DOI: 10.1109/THERMINIC.2019.8923530.
31. Santhanakrishnan M, Tilford T, Bailey C, Multi-Material Heatsink Design Using Level-Set Topology Optimization, (2019) IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 9, no. 8, pp. 1504-1513, Aug. 2019, DOI: 10.1109/TCPMT.2019.2929017.
32. Stoyanov S, Bailey C, Waite R, Hicks C, Golding T,(2019) Packaging Challenges and Reliability Performance of Compound Semiconductor Focal Plane Arrays, 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), Pisa, Italy, 2019, pp. 1-8, DOI: 10.23919/EMPC44848.2019.8951842.