Christopher Bailey
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Fulton School ECEE Room 161 ERC Tempe, AZ 85281
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Mail code: 5706Campus: Tempe
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Chris Bailey joined Arizona State University in 2022 where is Professor of Advanced Semiconductor Packaging and Director of the Centre for Advanced Semiconductor Packaging. Prior to this he was Professor of Computational Mechanics & Reliability and Associate Dean for Research at the University of Greenwich, UK. At ASU, Chris is leading on advanced semiconductor packaging, he is PI on an SRC funded project on Thermo-Mechanical Modelling and Reliability of Redistribution Layers, and Co-I on several large US-Chips-Act funded projects such as SWAP-Hub, SHIELD, and ITSI.
Chris has published 400+ archival papers in electronics packaging and received $40M+ from Government and Industry to support his research activities. From 2000-2010, he was Co-I on the UK Innovative Electronics Manufacturing Research Centre (IEMRC), and from 2010-2020 he was a Co-I on the UK Centre for Power Electronics. He has served on several UK Government and Research Council bodies including Engineering and Physical Sciences Research Council (EPSRC) Peer Review College (2016-2022), and the UK Research Excellence Framework (2010-2014).
He has been an invited Keynote speaker at numerous conferences internationally and was recently the Program Chair for the IEEE Int Conf. on Physical Assurance and Inspection of Electronics, PAINE, 2024. Chris was the Royal Society/Kao Tong Po Visiting Professor to Hong Kong, and in 2018 and 2022, he was a Visiting Professor to Indian Institute of Technology, Kharagpur. In 2022, he received the IEEE Electronics Packaging Society David Feldman Award and in 2024 he received the Societies Region 8 (Europe) award.
Since 2010, Chris has served on the IEEE Electronics Packaging Society Board of Govenor's, and from 2020-2021, he was the President of the society. He is an associate editor for the IEEE Transactions of Components, Packaging, and Manufacturing Technology; Chapter Chair for the IEEE-EPS Phoenix Chapter; and co-chair for the Co-Design and Modelling & Simulation chapters for the Heterogeneous Integration Roadmap (HIR).
MBA (Technology Management); Open Universsity, UK
PhD Thames Polytechnic, UK
Advanced Semiconductor Packaging
Thermal Management
Co-Design and Multiphysics Modelling
Reliability
Recent Publications:
- P. Rajaguru, T. Tilford, C. Bailey and S. Stoyanov, "Damage Mechanics-Based Failure Prediction of Wirebond in Power Electronic Module," in IEEE Access, vol. 12, pp. 25215-25227, (2024), doi: 10.1109/ACCESS.2023.3342689.
- S. Stoyanov and C. Bailey, "Modeling Insights Into the Assembly Challenges of Focal Plane Arrays," in IEEE Access, vol. 11, pp. 35207-35219, 2023, doi: 10.1109/ACCESS.2023.3264806.
- Nwanoro K, Lu H, Yin C, Bailey C, Advantages of the extended finite element method for the analysis of crack propagation in power modules (2023), Power Electronic Devices and Components, V4, DOI: 10.1016/j.pedc.2022.100027
- Xu Y, Xian J, Stoyanov S, Bailey C, Coyle R, Gourlay C, Dunne F, A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints, International Journal of Plasticity, V155, (2022), DOI: 10.1016/j.ijplas.2022.103308
- Stoyanov S, Bailey C, Deep Learning Modelling for Composite Properties of PCB Conductive Layers, (2022) 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), St Julian, Malta, 2022, pp. 1-7, DOI: 10.1109/EuroSimE54907.2022.9758885.
- Santhanakrishnan, M.S., Tilford, T. and Bailey, C, Multi-objective NSGA-II based shape optimisation of the cross-sectional shape of passively cooled heat sinks (2022), International Journal of Numerical Methods for Heat & Fluid Flow, Vol. 32 No. 3, pp. 1025-1045. DOI: 10.1108/HFF-10-2020-0656
- Tilford, T., Stoyanov, S., Bruan, J., Jahnsen JC., Patel, MK., Bailey, C. Comparative reliability of ink-jet printed electronics packaging (2021), IEEE Transactions on Components, Packaging, and Manufacturing Technology, 11 (2), pp 351-362 . DOI: 10.1109/TCPMT.2021.3049952.
- Rajaguru P, Bella M, Bailey C, Applying Model Order Reduction to the Reliability Prediction of Power Electronic Module Wirebond Structure (2021) 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Berlin, Germany, 2021, pp. 1-6, DOI: 10.1109/THERMINIC52472.2021.9626396.
- Stoyanov S, Stewart P, Bailey C, Reliability Optimisation and Lifetime Modelling of micro-BGA Assemblies in Harsh Environment Applications (2021) 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC), Gothenburg, Sweden, 2021, pp. 1-8, DOI: 10.23919/EMPC53418.2021.9584970.
- Daniel N, Stoyanov S, Bailey C, Flynn D, Review of Fusion Prognostics for Lithium-Ion Batteries - Current State and Future Challenges (2021) 44th International Spring Seminar on Electronics Technology (ISSE), Bautzen, Germany, 2021, pp. 1-8, DOI: 10.1109/ISSE51996.2021.9467644.
- Daniel N, Stoyanov S, Bailey C, Flynn D, Improved Battery Degradation Modelling with Coupled Physical and Machine Learning Modelling (2021) 44th International Spring Seminar on Electronics Technology (ISSE), Bautzen, Germany, 2021, pp. 1-6, DOI: 10.1109/ISSE51996.2021.9467565.
- Bailey C, Modeling for assessing Semiconductor Packages in High-Reliability Applications, (2021), 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), Chengdu, China, 2021, pp. 1-3, DOI: 10.1109/EDTM50988.2021.9434881
- Shahjalal M., Ahmed M.R., Lu H., Bailey C., Forsyth A.J. An Analysis of the Thermal Interaction between Components in Power Converter Applications (2020) IEEE Transactions on Power Electronics, 30 (9), pp. 9082 – 9094. DOI: 10.1109/TPEL.2020.2969350
- Ahsan M., Stoyanov S., Bailey C., Albarbar A. Developing Computational Intelligence for Smart Qualification Testing of Electronic Products (2020) IEEE Access, 8, pp. 16922 – 16933. DOI: 10.1109/ACCESS.2020.2967858
- Stoyanov S., Bailey C., Stewart P., Parker M., Roulston J.F. Experimental and modeling study on delamination risks for refinished electronic packages under hot solder dip loads (2020) IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (3), pp. 502 – 515. DOI: 10.1109/TCPMT.2020.2972635
- Yin C., Stoyanov S., Bailey C., Stewart P. Thermomechanical Analysis of Conformally Coated QFNs for High-Reliability Applications (2020) IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (11), pp. 2210 – 2218. DOI: 10.1109/TCPMT.2019.2925874
- Tonry C.E.H., Patel M.K., Yu W., Desmulliez M.P.Y., Bailey C. Fabrication of hollow polymer microstructures using dielectric and capillary forces (2020) Microsystem Technologies, 26 (2), pp. 301 – 308. DOI: 10.1007/s00542-019-04409-z
- Rajaguru P., Lu H., Bailey C., Bella M. Modelling and analysis of vibration on power electronic module structure and application of model order reduction (2020) Microelectronics Reliability, 110, DOI: 10.1016/j.microrel.2020.113697
- Hinojosa Herrera A.E., Walshaw C., Bailey C. Improving Black Box Classification Model Veracity for Electronics Anomaly Detection (2020) Proceedings of the 15th IEEE Conference on Industrial Electronics and Applications, ICIEA 2020, pp. 1092 – 1097, DOI: 10.1109/ICIEA48937.2020.9248258
- Stoyanov S., Bailey C., Stewart P., Morrison G. Reliability impact of assembly materials for Micro-BGA components in high reliability applications (2020) Proceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020, DOI: 10.1109/ESTC48849.2020.9229828
- Stoyanov S, Bailey C, Waite R, Hicks C, Golding T, Modelling Indium Interconnects for Ultra Fine-Pitch Focal Plane Arrays,(2020) 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Orlando, FL, USA, 2020, pp. 1139-1146, DOI: 10.1109/ITherm45881.2020.9190397.
- Herrera, A, Walshaw C, Bailey C, Failure Mode & Effect Analysis and another Methodology for Improving Data Veracity and Validity Annals of Emerging Technologies in Computing (AETiC), pp. 9-16, Vol. 4, No. 3, (2020, DOI: 10.33166/AETiC.2020.03.002.
- Bailey C, Advances in Power Electronics (2020) Pan Pacific Microelectronics Symposium (Pan Pacific), HI, USA, 2020, pp. 1-4, DOI:10.23919/PanPacific48324.2020.9059348.
- Stoyanov, S., Ahsan, M., Bailey, C., Wotherspoon, T., Hunt, C. Predictive analytics methodology for smart qualification testing of electronic components (2019) Journal of Intelligent Manufacturing, 30 (3), pp. 1497-1514. DOI: 10.1007/s10845-018-01462-9
- Rajaguru, P., Lu, H., Bailey, C. Time integration damage model for Sn3.5Ag solder interconnect in power electronic module (2019) IEEE Transactions on Device and Materials Reliability, 19 (1), art. no. 8606225, pp. 140-148. DOI: 10.1109/TDMR.2019.2891949
- Tonry, C.E.H., Patel, M.K., Yu, W., Desmulliez, M.P.Y., Bailey, C. Fabrication of hollow polymer microstructures using dielectric and capillary forces (2019) Microsystem Technologies, DOI: 10.1007/s00542-019-04409-z
- Dinmohammadi, F., Flynn, D., Bailey, C., Pecht, M., Yin, C., Rajaguru, P., Robu, V. Predicting damage and life expectancy of subsea power cables in offshore renewable energy applications (2019) IEEE Access, 7, art. no. 8704223, pp. 54658 -54669. DOI: 10.1109/ACCESS.2019.2911260
- Adamietz, R., Desmulliez, M.P.Y., Pavuluri, S.K., Tilford, T., Bailey, C., Schreier-Alt, T., Warmuth, J. Reliability Testing and Stress Measurement of QFN Packages Encapsulated by an Open-Ended Microwave Curing System (2019) IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1), art. no. 8418396, pp. 173-180. DOI: 10.1109/TCPMT.2018.2859031
- Malik, A., Bailey, C., Stoyanov, S. Identifying the Optimal Step Size for Gradient Descent Using Monte Carlo Simulation in Optimisation of Micro-laser Welding of Optoelectronics (2019) ITT 2018 - Information Technology Trends: Emerging Technologies for Artificial Intelligence, art. no. 8649548, pp. 281-285. DOI: 10.1109/CTIT.2018.8649548
- Rajaguru P, Santhanakrishnan M, Tilford T, Bailey C, Design of Additively Manufactured Heatsinks for Power Electronics Thermal Management using Adjoint Level-set Topology Optimization (2019) 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Lecco, Italy, 2019, pp. 1-7, DOI: 10.1109/THERMINIC.2019.8923530.
- Santhanakrishnan M, Tilford T, Bailey C, Multi-Material Heatsink Design Using Level-Set Topology Optimization, (2019) IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 9, no. 8, pp. 1504-1513, Aug. 2019, DOI: 10.1109/TCPMT.2019.2929017.
- Stoyanov S, Bailey C, Waite R, Hicks C, Golding T,(2019) Packaging Challenges and Reliability Performance of Compound Semiconductor Focal Plane Arrays, 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), Pisa, Italy, 2019, pp. 1-8, DOI: 10.23919/EMPC44848.2019.8951842.
Courses
2025 Spring
| Course Number | Course Title |
|---|---|
| EEE 590 | Reading and Conference |
| EEE 493 | Honors Thesis |
| EEE 790 | Reading and Conference |
| EEE 592 | Research |
| EEE 499 | Individualized Instruction |
| EEE 690 | Reading and Conference |
| EEE 595 | Continuing Registration |
| EEE 492 | Honors Directed Study |
| EEE 599 | Thesis |
| EEE 792 | Research |
| EEE 799 | Dissertation |
| EEE 595 | Continuing Registration |
| MAE 599 | Thesis |
| MAE 792 | Research |
| EEE 590 | Reading and Conference |
| CEN 595 | Continuing Registration |
| CEN 790 | Reading and Conference |
| EEE 795 | Continuing Registration |
| CEN 599 | Thesis |
| CEN 580 | Practicum |
| CEN 584 | Internship |
| CEN 792 | Research |
| CEN 799 | Dissertation |
| CEN 590 | Reading and Conference |
| CEN 795 | Continuing Registration |
| EEE 492 | Honors Directed Study |
| EEE 493 | Honors Thesis |
| EEE 499 | Individualized Instruction |
| CEN 690 | Reading and Conference |
| MAE 593 | Applied Project |
| EEE 518 | Fund of Semiconductor Pack |
| EEE 499 | Individualized Instruction |
2024 Fall
| Course Number | Course Title |
|---|---|
| EEE 492 | Honors Directed Study |
| EEE 493 | Honors Thesis |
| EEE 499 | Individualized Instruction |
| EEE 590 | Reading and Conference |
| EEE 595 | Continuing Registration |
| EEE 599 | Thesis |
| EEE 690 | Reading and Conference |
| EEE 790 | Reading and Conference |
| EEE 792 | Research |
| EEE 795 | Continuing Registration |
| EEE 799 | Dissertation |
| EEE 592 | Research |
| MAE 595 | Continuing Registration |
| MAE 599 | Thesis |
| MAE 792 | Research |
| CEN 792 | Research |
| EEE 792 | Research |
| EEE 492 | Honors Directed Study |
| EEE 493 | Honors Thesis |
| EEE 499 | Individualized Instruction |
| EEE 499 | Individualized Instruction |
| CEN 690 | Reading and Conference |
| EEE 598 | Special Topics |
| CEN 792 | Research |
2024 Summer
| Course Number | Course Title |
|---|---|
| EEE 690 | Reading and Conference |
| EEE 590 | Reading and Conference |
| EEE 790 | Reading and Conference |
| EEE 795 | Continuing Registration |
| EEE 792 | Research |
| EEE 799 | Dissertation |
| EEE 595 | Continuing Registration |
| EEE 599 | Thesis |
| EEE 592 | Research |
| MAE 792 | Research |
| EEE 592 | Research |
| EEE 595 | Continuing Registration |
| EEE 599 | Thesis |
| EEE 792 | Research |
| EEE 795 | Continuing Registration |
| EEE 799 | Dissertation |
| EEE 590 | Reading and Conference |
| EEE 590 | Reading and Conference |
| EEE 592 | Research |
| EEE 599 | Thesis |
| CEN 792 | Research |
2024 Spring
| Course Number | Course Title |
|---|---|
| EEE 592 | Research |
| EEE 493 | Honors Thesis |
| EEE 499 | Individualized Instruction |
| EEE 690 | Reading and Conference |
| EEE 595 | Continuing Registration |
| EEE 492 | Honors Directed Study |
| EEE 599 | Thesis |
| EEE 792 | Research |
| EEE 799 | Dissertation |
| EEE 595 | Continuing Registration |
| EEE 792 | Research |
| EEE 592 | Research |
| EEE 595 | Continuing Registration |
| EEE 590 | Reading and Conference |
| EEE 595 | Continuing Registration |
| EEE 795 | Continuing Registration |
| CEN 792 | Research |
| EEE 590 | Reading and Conference |
| EEE 590 | Reading and Conference |
| EEE 592 | Research |
| EEE 792 | Research |
| EEE 790 | Reading and Conference |
| EEE 790 | Reading and Conference |
| EEE 492 | Honors Directed Study |
| EEE 493 | Honors Thesis |
| EEE 499 | Individualized Instruction |
| CEN 792 | Research |
| EEE 518 | Fund of Semiconductor Pack |
| EEE 499 | Individualized Instruction |
2023 Fall
| Course Number | Course Title |
|---|---|
| EEE 492 | Honors Directed Study |
| EEE 493 | Honors Thesis |
| EEE 499 | Individualized Instruction |
| EEE 590 | Reading and Conference |
| EEE 595 | Continuing Registration |
| EEE 599 | Thesis |
| EEE 690 | Reading and Conference |
| EEE 790 | Reading and Conference |
| EEE 792 | Research |
| EEE 795 | Continuing Registration |
| EEE 799 | Dissertation |
| EEE 592 | Research |
| EEE 792 | Research |
| EEE 592 | Research |
| EEE 590 | Reading and Conference |
| EEE 492 | Honors Directed Study |
| EEE 493 | Honors Thesis |
| EEE 499 | Individualized Instruction |
| EEE 499 | Individualized Instruction |
| EEE 598 | Special Topics |
| CEN 792 | Research |
2023 Spring
| Course Number | Course Title |
|---|---|
| EEE 790 | Reading and Conference |
| EEE 592 | Research |
| EEE 493 | Honors Thesis |
| EEE 499 | Individualized Instruction |
| EEE 690 | Reading and Conference |
| EEE 595 | Continuing Registration |
| EEE 492 | Honors Directed Study |
| EEE 599 | Thesis |
| EEE 792 | Research |
| EEE 799 | Dissertation |
| EEE 595 | Continuing Registration |
| EEE 792 | Research |
| EEE 590 | Reading and Conference |
| EEE 795 | Continuing Registration |
| EEE 492 | Honors Directed Study |
| EEE 493 | Honors Thesis |
| EEE 499 | Individualized Instruction |
| EEE 518 | Fund of Microelectronics Pack |
2022 Fall
| Course Number | Course Title |
|---|---|
| EEE 492 | Honors Directed Study |
| EEE 493 | Honors Thesis |
| EEE 499 | Individualized Instruction |
| EEE 590 | Reading and Conference |
| EEE 595 | Continuing Registration |
| EEE 599 | Thesis |
| EEE 690 | Reading and Conference |
| EEE 790 | Reading and Conference |
| EEE 792 | Research |
| EEE 795 | Continuing Registration |
| EEE 799 | Dissertation |
| EEE 592 | Research |
| EEE 492 | Honors Directed Study |
| EEE 493 | Honors Thesis |
| EEE 499 | Individualized Instruction |
| EEE 499 | Individualized Instruction |
Chris is teaching the following courses:
EEE518: Fundamentals of Semiconductor Packaging (Spring)
EEE598: Co-Design and Modelling for Advanced Semiconductor Packaging
IEEE Electronics Packaging Society, Region 8 (Europe) Award (2024)
IEEE Electronics Packaging Society, David Felman Award (2022)
EuroSime Conference, Lifetime Achievement Award (2022)
President, IEEE Electronics Packaging Society, (2020-2021)
Member of Peer Review College, Engineering and Physical Sciences Research Council (EPSRC), 2016-2022
Panel Member, UK Research Excellence Framework (REF), (2010-2014)
Outstanding Research Project, Times Higher Education Award (2009)
Royal Society/Kan Tong Po Visiting Professor to Hong Kong (2003)
Associate Editor, IEEE Transactions on Components, Packaging and Manufacturing Technologies (2016-)
Associate Editor, ASME Journal of Electronics Packaging (2023-)
Associate Editor, Journal of Mechanics (2018-)
Member of Board of Governors, IEEE Electronics Packaging Society, (2010-)
Chapter Chair, IEEE Electronics Packaging Society, Pheonix Chapter, (2023-)
Chapter Chair, IEEE Electronics Packaging Society, UK & Ireland Chapter, (2010-2022)
Member, International Microelectronics Assembly and Packaging Society, (2010-)
Conference Leadership:
Program Chair, IEEE Int Conference on Physical Assurance and Inspection of Electronics (PAINE), (2024)
General Chair, IEEE Therminic Conference, Budapest, Hungary, (2016)
Program Chair, IEEE Therminic Conference, Paris, France, (2015)
Local Chair, IEEE Therminic Conference, London, UK, (2014)
Program Chair, IEEE Nano, Portland, USA, (2011)
General Chair, IEEE Electronics System-Integration Conference (ESTC), London, UK, (2008)
General Chair, Eurosime Conference, London, UK, (2007)
Program Chair, IEEE Electronics System-Integration Conference (ESTC), Dresden, Germany, (2006)
Conference Committee Membership
Electronic Components and Technology Conference (ECTC), (2012-)
Electronics Packaging and Technology Conference (EPTC), (2010-)
Electronics System-Integration Conference (ESTC), (2006-)
EuroSime (2006-)
External Examiner
Heriot-Watt University, (2018-2022)
PhD Examiner
Examined PhD’s at the following Universities: Brunel, Heriot-Watt, Oxford Brookes, Birmingham, Loughborough, Lancaster, Leeds, Sheffield, Imperial College, Nottingham, Liverpool John Moores, Delft (Netherlands), Chalmers (Sweden), HKUST (Hong Kong), Tampere (Sweden)
Consulted with 40+ Organizations in Semiconductor Packaging, Examples include
BAe Systems, Agilent Technology, Flomerics Limited, Alcatel, Cooksons, Hewlett Packard, Celestica Limited, GE-Aviation, NXP, British Oxygen, TRW, National Physics Laboratory, NIST (USA), Henkel/Loctite, Tin-Technology, Merlin Circuits, Selex, Henkel, TWI, Epigem, Dynex Semiconductors, Semelab, Goodrich Engines, General Electric, Rolls Royce.
Expert Witness work with Bird & Bird (2020) and Irell & Mandella (2014, 2026)
IEEE Electronics Packaging Society, Board Member (2010-)